Mfg Part Number: P4C116 45LMB | Alternate P/N: P4C11645LMB | NSN : 5962-01-299-4554 |
NIIN : 012994554 | CAGE Code : 3DTT2 | Manufacturer: Pyramid Semiconductor Corp |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Nascent Industrial is your one-stop shop for top quality part P4C116 45LMB under NSN 5962-01-299-4554, that of which is listed with the description “Microcircuit Memory.” With the NSN part number P4C116 45LMB, this particular NSN Part was manufactured by Pyramid Semiconductor Corp. If you are interested in this item, we have current availability and encourage you to utilize the form provided to you below to request a quote for your comparisons with ease. With the various details that you submit, our team members will formulate a customized solution that caters to your requirements. To ensure that your procurement process is efficient and quick, we guarantee responses to quote requests within 15 minutes of receiving a completed form.
To make certain that customers procure the exact items that they need, we list products alongside all relevant information. For instance, this Pyramid Semiconductor Corp NSN part P4C116 45LMB was specifically produced under the CAGE Code 3DTT2. Additionally, all items ship out alongside their qualifying certifications and manufacturing trace documentation, as applicable. Due to our peerless dedication to quality control and export compliance, we conduct business with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. If you are ready to procure NSN 5962-01-299-4554 or simply want more information on what we can do for you, get in touch with a representative at your earliest convenience.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-299-4554 Item Description: MICROCIRCUIT,MEMORY | 5962 | 012994554 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
QP7C128A-45LMB | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.392 INCHES MINIMUM AND 0.408 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.292 INCHES MINIMUM AND 0.308 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.062 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIDIRECTIONAL AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 LEADLESS |
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